Important Dates (all in 23:59 GMT)
Abstract submission (extended): 15 June, 2019
Full paper submission (extended): 22 June, 2019
Workshop proposals (extended): 5 July, 2019
Tutorials, panel, and demos proposals: TBA
Paper notification: 1 August, 2019
Camera-ready paper submission: 31 August, 2019
20th International Conference on Web Information Systems Engineering (WISE 2019)
26-30 November 2019
Hong Kong, China
Welcome to WISE 2019

 

The 2019 edition of the International Conference on Web Information Systems Engineering (WISE 2019) will be held in Hong Kong in November, 2019. It marks the 20th anniversary of the conference, which was first held in Hong Kong in 2000.

 

WISE has established itself as a community aiming at high quality research and offering the ground for advancing efforts in topics related to Web information systems. WISE 2019 will be an international forum for researchers, professionals, and industrial practitioners to share their knowledge and insights in the rapidly growing areas of Web technologies for Big Data and Artificial Intelligence (AI), two highly important areas for the world economy. The conference will capitalize on the integration of geographically close cities via various internet-based and web-based technologies, such as IoT, to enhance the development and betterment of city clusters, as exemplified by the Bay Area along the Pacific, New England Area along the Atlantic, Tokyo-Yokohama area, and the upcoming Greater Bay Area.

 

Previous WISE conferences were held in Hong Kong, China (2000), Kyoto, Japan (2001), Singapore (2002), Roma, Italy (2003), Brisbane, Australia (2004), New York, USA (2005), Wuhan, China (2006), Nancy, France (2007), Auckland, New Zealand (2008), Poznan, Poland (2009), Hong Kong, China (2010), Sydney, Australia (2011), Paphos, Cyprus (2012), Nanjing, China (2013), Thessaloniki, Greece (2014), USA (2015), Shanghai, China (2016), Puschino, Russia (2017), and Dubai, UAE (2018).

 

Submission link: https://easychair.org/conferences/?conf=wise20190
Submission format: http://www.springer.de/comp/lncs/authors.html
More submission information

Sponsors

Springer

HP

HP

HP